MForum.ru
SISDA - Mobile World Congress Barcelona 2008
SIDSA launches the World’s first demodulator plus application processor Silicon for Portable and Mobile TV. To be exhibited in the Mobile World Congress in Barcelona, from February 11th at booth J41, Hall 2 and and Spanish Pavillion, 2є Floor, stand CY14
SIDSA enters the DVB-H semiconductor market with its new Enter e1 demodulator plus application processor chipset. This new chipset complements the current offering of Intellectual Property for DVB-H demodulator. SIDSA is the leading provider of DVB-H demodulator Intellectual Property and counts as IP customers to three of the top semiconductor vendors.
The Enter e1 demodulator chipset provides best-in-class performance, specially in high speed conditions or high spectrum operation. The chipset targets easy integration into any device thanks to the internal memory and application processor that can handle all the heavy DVB-H stuff (PSI/SI parsing, handover, ESG parsing…) up to and excluding the user interface and video & audio playing.
“Our main objective is to enable rapid integration into any kind of DVB-H device such as mobile phones, Portable Media Players, PDAs, etc.”, said Mr. Federico Ruiz, senior Vice President of Engineering at SIDSA, “while keeping the best-in-class performance”.
SIDSA is known by its commitment to Mobile TV deployments and overall project management. “We make solutions that work in real end-to-end systems”, said Mr. Fernandez, Head of Business Development at SIDSA. The company has placed all its know-how to achieve a demodulator chipset that can work in any condition faced in real network deployments.
Some key characteristics:
• Full DVB-T and DVB-H support • Fully MBRAI compliant (exceeding most MBRAI requirements) • Support of all main Silicon tuners in the market • Support of 5/6/7/8 MHz channel bandwidths • Multi service MPE-FEC processing • Multi interface: SPI, Ethernet, TS, USB, SDIO • High Doppler resilience, more than 250 Hz in 8K mode • Less than 4 ms synchronisation time • Low power consumption: less than 40 mW • Diversity ready • Internal on-chip 8 Mb dynamic memory and embedded ARM processorRecently the company has announced a second generation chipset ready for beginning of 2009 and including multi-standard capabilities as full support of DVB-H, DVB-SH and Chinese Mobile TV Standards.
About SIDSA
SIDSA is an audiovisual technology provider with activity areas in semiconductors, conditional access, digital headends and overall project management. SIDSA headquarters are in Madrid (Spain), but currently has offices in Dubai, Hong Kong, Moscow and San Francisco. In 2006 SIDSA received an investment from the Spanish private equity and venture capital groups: Inova Capital and Baring Group, which has speeded up its international expansion and growth.
Extended company information
SIDSA’s digital TV headend portfolio includes contribution and distribution network solutions, broadcast-to-IPTV EtherTV gateways and terrestrial and mobile digital TV platforms, POLARplus, where the company has developed the most compact but fully featured headend product line in the market place.
SIDSA, PTM - Torres Quevedo 1, 28760 Tres Cantos, Madrid, Spain
Tel: +34 91 803 50 52
Fax: +34 91 803 95 57
Web: http://www.sidsa.com
E-mail: pr@sidsa.com
02.07. [Новинки] Cлухи: Появились подробности о Google Pixel 10 Pro и Google Pixel 10 Pro XL / MForum.ru
02.07. [Новинки] Анонсы: Nothing Phone (3) с Glyph Matrix представлен официально / MForum.ru
01.07. [Новинки] Слухи: Moto G96 5G может быть представлен 9 июля / MForum.ru
01.07. [Новинки] Слухи: Появились данные о размере батареи Redmi Turbo 5 Pro / Poco F8 / MForum.ru
30.06. [Новинки] Анонсы: Xiaomi Watch S4 41 мм и Band 10 представлены официально / MForum.ru
27.06. [Новинки] Анонсы: Xiaomi Pad 7S Pro 12.5 на чипсете Xring O1 представлен официально / MForum.ru
26.06. [Новинки] Анонсы: Redmi K80 Ultra представлен официально / MForum.ru
26.06. [Новинки] Анонсы: Экологичный смартфон Fairphone 6 представлен официально / MForum.ru
25.06. [Новинки] Анонсы: Poco F7 на чипсете Snapdragon 8s Gen 4 представлен официально / MForum.ru
24.06. [Новинки] Анонсы: Galaxy Unpacked 2025 состоится 9 июля / MForum.ru
24.06. [Новинки] Анонсы: Компактный смартфон Vivo X200 FE представлен официально / MForum.ru
23.06. [Новинки] Анонсы: Oppo K13x 5G представлен как «самый надежный смартфон в сегменте» / MForum.ru
23.06. [Новинки] Слухи: Толщина Honor Magic V5 составит 8,8 мм / MForum.ru
20.06. [Новинки] Слухи: Раскрыты подробности о Redmi K80 Ultra / MForum.ru
20.06. [Новинки] Слухи: Honor Magic V5 может стать самым тонким складным смартфоном в мире / MForum.ru
19.06. [Новинки] Анонсы: Глобальная версия Oppo Reno 14 5G представлена в Японии / MForum.ru
19.06. [Новинки] Анонсы: Oppo Reno 13A для японского рынка представлен официально / MForum.ru
19.06. [Новинки] Анонсы: Бюджетный смартфон iQOO Z10 Lite официально представлен в Индии / MForum.ru
18.06. [Новинки] Анонсы: Fujitsu Arrows F-51F представлен официально / MForum.ru
17.06. [Новинки] Слухи: Раскрыты основные подробности о Redmi K Pad / MForum.ru